
MMSZ5242B
Planar Die Construction . Ultra-Small Surface Mount Package. General purpose, Medium Current . Ideally Suited for Automated Assembly Processes.

Planar Die Construction . Ultra-Small Surface Mount Package. General purpose, Medium Current . Ideally Suited for Automated Assembly Processes.

The SMAJ5.0A is a fantastic electronic component that offers a plethora of benefits. Firstly, it has a low profile, which makes it easy to install in various devices. Additionally, it features a

The MC100EPT21 is a Differential LVPECL/LVDS/CML to LVTTL/LVCMOS translator.

IDW75E60 is a high-quality semiconductor device equipped with advanced 600V EmCon technology to ensure smooth and efficient performance. It features fast recovery to enhance reliability and prevent

The plastic package carries Underwriters Laboratory Flammability Classification 94V-0 . Good for printed circuit boards . Low reverse leakage . Capability of high forward surge current. High

Total power dissipation: Max. 500mW.. Wide zener reverse voltage range 2.0V to 75V.. Small plastic package suitable for surface mounted design.. Tolerance approximately±5%.

In MiniMELF case especially for automatic insertion. The Zener voltages are graded according to the international E 24 standard. Smaller voltage tolerances and higher Zener voltages are upon

Planar Die Construction . 350mW Power Dissipation on Ceramic PCB . General Purpose, Medium Current . Ideally Suited for Automated Assembly Processes . Available in Lead Free Version.

Complete voltage range 3.3 to 100 volts . High peak reverse power dissipation . High reliability. Low leakage current . Standard zener voltage tolerance is ± 5%. . Pb / RoHS Free.

Guardring for overvoltage protection. Low power loss . Extremely fast switching. High forward surge capability . High frequency operation . Solder dip 260 °C max. 10 s, per JESD 22-B106.

Metal silicon junction, majority carrier conduction . For surface mounted applications . Low power loss, high efficiency . High forward surge current capability . For use in low voltage, high

Low profile package . Ideal for automated placement . Ultrafast reverse recovery time . Low power losses, high efficiency . Low forward voltage drop . High surge capability . High temperature