Electronic Component Memory K4Z80325BC-HC14

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Introducing the K4Z80325BC-HC14: a Reliable and Efficient Memory Solution for Your Devices

As technology advances, the need for more storage and better performance capability becomes a requirement in the market. Smartphones, laptops, digital cameras, and many other devices utilize memory components to store data and provide smooth multitasking functions. As a manufacturer of memory modules, we understand that quality, reliability, and performance are essential factors to meet market demands. Introducing K4Z80325BC-HC14, a high-quality memory module that delivers efficient and reliable storage solutions to your devices.

Product Overview

The K4Z80325BC-HC14, designed with 8Gb (1GB) SDRAM, is a Double Data Rate 3 (DDR3) module that provides excellent performance when it comes to data transfer and multitasking capabilities. This memory module operates at a high speed of 1866MHz, giving you faster data processing and storage. With a compact size of 78-ball FBGA, it allows you to design your devices more efficiently and enables you to maximize space in your gadgets.

Enhanced Data Integrality and Performance

The K4Z80325BC-HC14 delivers excellent performance with its advanced features, such as dynamic on-die termination, a digital signal processing engine, and additive latencies, amongst others. Moreover, the module uses Source Synchronous Datapath Design and Least Latency Aware Selection Algorithm. The algorithm ensures that the memory chip operates at its optimal latency by recognizing the precise latencies of adjacent memory chips. This reduces the potential for data signal interference, improving the data integrity of transmitted data.

Lower Power Consumption

Power consumption is a concern when it comes to electronic devices, especially for gadgets that rely on batteries, such as smartphones and tablets. The K4Z80325BC-HC14 is designed with a lower power consumption methodology, making it an ideal choice for battery-powered devices. This module offers a Low Power Self-Refresh (LPSR) mode that significantly reduces power consumption, which includes an auto-temperature calibration feature, reducing the impact of temperature changes on power consumption. This feature ensures that your battery lasts longer, enabling the user to maximize device usage.

Product Durability and Reliability

We understand that the durability and reliability of memory modules are critical factors for you and your customers. The K4Z80325BC-HC14 is designed with several features that ensure the durability and reliability of the memory chips, providing long-lasting and high-performance modules. One of the significant features, the temperature-activated refresh, maintains the memory cells throughout different temperatures, ensuring it operates effectively, even during temperature fluctuations. Additionally, we use an advanced stack package technology and an integrated thermal heat spreader that enhances heat management, minimizing heat generation, and enhancing thermal performance.

Conclusion

In summary, we believe that the K4Z80325BC-HC14 is an excellent choice for your memory module needs. Its advanced features, including its speed, power consumption, and reliability, allow it to deliver faster data transfer rates, lower power consumption while keeping the data protected and accessible. With our high standard production and testing procedures and an eager team of professionals, we reassure you that the K4Z80325BC-HC14 memory module is worth your investment, providing you with the necessary technological advancements that your devices require.

Features

• 2 separate independent channels with point-to-point interface for data, address and command 

• Half CA data rate differential clock inputs CK_t/CK_c for CMD/ADD (CA) per 2 channels 

• Four half data rate differential clock inputs WCK_t/WCK_c, each associated with a data byte (DQ, DBI_n, EDC) in the channel 

• Double Data Rate (DDR) data (with regards to the WCK) 

• Double Data Rate (DDR) Command Address (with regards to the CK) 

• 16 internal banks 

• 4 bank groups for tCCDL = 3 tCK and 4 tCK 

• 16n prefetch architecture: 256 bit per array read or write access per channel 

• Burst length: 16 only 

• Programmable READ latency: 9 to 31 tCK 

• Programmable WRITE latency: 5 to 8 tCK 

• WRITE Data mask function via CA bus (single/double byte mask) 

• Data bus inversion (DBI) & Command Address bus inversion (CABI) 

• Command Address training: command address input monitoring by DQ/ DBI_n/EDC signals 

• WCK2CK clock training with phase information by EDC signals 

• Data read and write training via READ FIFO (depth 6) 

• READ FIFO pattern preload by LDFF command 

• Direct write data load to READ FIFO by WRTR command 

• Consecutive read of READ FIFO by RDTR command 

• Read/Write data transmission integrity secured by cyclic redundancy check using either a half or full data rate CRC 

• READ/WRITE EDC on/off mode 

• Programmable EDC hold pattern for CDR 

• Programmable CRC READ latency = 1 to 4 tCK and CRC WRITE latency = 10 to 16 tCK 

• Low Power modes 

• On-chip temperature sensor with read-out 

• Auto precharge for each burst access 

• Auto refresh & self refresh modes 

• 32ms, auto refresh (16k cycles) 

• Temperature sensor controlled self refresh rate and Partial Array Self Refresh 

• Per-Bank / Per-2-Bank Refresh 

• On-die termination (ODT) 

• ODT and output driver strength auto-calibration with external resistor ZQ 

• Programmable termination and driver strength offsets (40 ohm to 60ohm) 

• Internal VREF for data inputs and CA inputs with programmable levels 

• Separate internal VREF for CA (Command / Address) inputs 

• Vendor ID1 and ID2 for identification 

• x16/x8 mode configuration set at power-up with EDC 

• Pseudo-channel mode (PC mode) configuration set at power up with CA6 

• 1.35V +/- 0.0405V supply for device operation (VDD) (Specific parts support 1.25V + 0.0375V) 

• 1.35V +/- 0.0405V supply for I/O interface (VDDQ) (Specific parts support 1.25V + 0.0375V) 

• 1.8 + 0.108V / - 0.054V supply for VPP 

• 180 ball BGA package with 0.75mm pitch 

• IEEE1149.1 compliant boundary scan

Why choose us?

• We have a proven track record of delivering reliable products that meet and exceed industry standards.
• Our continuous innovation ability comes from both the organized creation of the group and the unique creativity of the individual.
• We are committed to sustainable practices, ensuring our manufacturing process is eco-friendly.
• With a positive and progressive attitude to customer's interest, our enterprise continually improves our products excellent to meet the wants of customers and further focuses on safety, reliability, environmental requirements, and innovation of K4Z80325BC-HC14.
• We believe in transparency and honesty in all our business dealings.
• We will work whole-heartedly to improve our products and services.
• We use secure payment and delivery methods to protect your interests.
• You may find the lowest price here.
• Our commitment to quality means we never compromise on the integrity of our products.
• We have gone through ups and downs on our way forward, and share the joys and sorrows and work tenaciously with all employees and partners.

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