
MM1Z3V0
Total power dissipation: Max. 500mW.. Wide zener reverse voltage range 2.0V to 75V.. Small plastic package suitable for surface mounted design.. Tolerance approximately±5%.

Total power dissipation: Max. 500mW.. Wide zener reverse voltage range 2.0V to 75V.. Small plastic package suitable for surface mounted design.. Tolerance approximately±5%.

The SMAJ5.0A is a fantastic electronic component that offers a plethora of benefits. Firstly, it has a low profile, which makes it easy to install in various devices. Additionally, it features a

IDW75E60 is a high-quality semiconductor device equipped with advanced 600V EmCon technology to ensure smooth and efficient performance. It features fast recovery to enhance reliability and prevent

The NSR0320MW2T1G is a high-quality diode that possesses numerous benefits for a wide range of applications. One of the most notable benefits is its low forward voltage.

The D2PAK Power Rectifier is a state−of−the−art device that employs the use of the Schottky Barrier principle with a platinum barrier metal.

RB021VAM90

These Schottky barrier diodes are designed for high−speed switching applications, circuit protection, and voltage clamping.Extremely low forward voltage reduces conduction loss. Miniature surface

In MiniMELF case especially for automatic insertion. The Zener voltages are graded according to the international E 24 standard. Smaller voltage tolerances and higher Zener voltages are upon

Planar Die Construction . 350mW Power Dissipation on Ceramic PCB . General Purpose, Medium Current . Ideally Suited for Automated Assembly Processes . Available in Lead Free Version.

Planar Die Construction . Ultra-Small Surface Mount Package. General purpose, Medium Current . Ideally Suited for Automated Assembly Processes.

Complete voltage range 3.3 to 100 volts . High peak reverse power dissipation . High reliability. Low leakage current . Standard zener voltage tolerance is ± 5%. . Pb / RoHS Free.

Guardring for overvoltage protection. Low power loss . Extremely fast switching. High forward surge capability . High frequency operation . Solder dip 260 °C max. 10 s, per JESD 22-B106.