
BZT52C5V1
Planar Die Construction . 350mW Power Dissipation on Ceramic PCB . General Purpose, Medium Current . Ideally Suited for Automated Assembly Processes . Available in Lead Free Version.

Planar Die Construction . 350mW Power Dissipation on Ceramic PCB . General Purpose, Medium Current . Ideally Suited for Automated Assembly Processes . Available in Lead Free Version.

This Schottky rectifier is designed for switch mode power supply and high frequency DC to DC converters.The STPS8170DEE-TR is a power Schottky rectifier that boasts a range of impressive features.

The SMAJ5.0A is a fantastic electronic component that offers a plethora of benefits. Firstly, it has a low profile, which makes it easy to install in various devices. Additionally, it features a

IDW75E60 is a high-quality semiconductor device equipped with advanced 600V EmCon technology to ensure smooth and efficient performance. It features fast recovery to enhance reliability and prevent

The TURBOSWITCH is a very high performance series of ultra-fast high voltage power diodes from 600V to 1200V.

RB021VAM90

Fast Switching Device (TRR<4.0ns). Power Dissipation of 350mW. High Stability and High Reliability. Low reverse leakage.

Total power dissipation: Max. 500mW.. Wide zener reverse voltage range 2.0V to 75V.. Small plastic package suitable for surface mounted design.. Tolerance approximately±5%.

In MiniMELF case especially for automatic insertion. The Zener voltages are graded according to the international E 24 standard. Smaller voltage tolerances and higher Zener voltages are upon

Planar Die Construction . Ultra-Small Surface Mount Package. General purpose, Medium Current . Ideally Suited for Automated Assembly Processes.

Complete voltage range 3.3 to 100 volts . High peak reverse power dissipation . High reliability. Low leakage current . Standard zener voltage tolerance is ± 5%. . Pb / RoHS Free.

Guardring for overvoltage protection. Low power loss . Extremely fast switching. High forward surge capability . High frequency operation . Solder dip 260 °C max. 10 s, per JESD 22-B106.