MMBD1503A
Low Leakage. High Conductance.
MB6S
General purpose use in AC/DC bridge full wave rectification for power supply, lighting ballast, battery charger, home appliances, office equipment, and telecommunication applications.
KBP410
Rating to 1000V PRV . Ideal for printed circuit board . Reliable low cost construction utilizing molded plastic technique . The plastic material has UL flammability classification 94V#0.
KBPC810
UL recognition, file #E230084 . Suitable for printed circuit board or chassis mounting . Compact construction . High surge current capability . Solder dip 275 °C max. 7 s, per JESD 22-B106.
2W10
The plastic package carries Underwriters Laboratory Flammability Classification 94V-0 . Good for printed circuit boards . Low reverse leakage . Capability of high forward surge current. High
KBP210
The plastic package carries Underwriters Laboratory Flammability Classification 94V-0 . Ideal for printed circuit boards . Low reverse leakage . High forward surge current capability . High
MM1Z3V0
Total power dissipation: Max. 500mW.. Wide zener reverse voltage range 2.0V to 75V.. Small plastic package suitable for surface mounted design.. Tolerance approximately±5%.
ZMM6V8
In MiniMELF case especially for automatic insertion. The Zener voltages are graded according to the international E 24 standard. Smaller voltage tolerances and higher Zener voltages are upon
BZT52C5V1
Planar Die Construction . 350mW Power Dissipation on Ceramic PCB . General Purpose, Medium Current . Ideally Suited for Automated Assembly Processes . Available in Lead Free Version.
MMSZ5242B
Planar Die Construction . Ultra-Small Surface Mount Package. General purpose, Medium Current . Ideally Suited for Automated Assembly Processes.
1SMA4751A
Complete voltage range 3.3 to 100 volts . High peak reverse power dissipation . High reliability. Low leakage current . Standard zener voltage tolerance is ± 5%. . Pb / RoHS Free.
1N5822
Guardring for overvoltage protection. Low power loss . Extremely fast switching. High forward surge capability . High frequency operation . Solder dip 260 °C max. 10 s, per JESD 22-B106.