Key Features
Memory Density: 24Gb (Gigabit)
Organization:
6Gb × 4 dies stacked (typical configuration)
32-bit data width (x32)
Technology: LPDDR4 SDRAM
Voltage:
VDD2: 1.1V (core)
VDDQ: 0.6V (I/O, LPDDR4X-compatible low-power signaling)
Data Rates: Up to 4266 Mbps per pin (speed-bin dependent)
Package: FBGA (Fine-pitch BGA), slim-profile
Low-Power Features:
Deep Sleep Mode (DSM)
Partial Array Self Refresh (PASR)
Adaptive Refresh
High Reliability: Ideal for long-term embedded use
Hot Tags: k4f6e3s4hm-thcl, China k4f6e3s4hm-thcl suppliers, manufacturers
